微电子专业英语 英文版

This book consists of 9 chapters which can be divided into four parts in content: Chapters 1～2 introduces the basic knowledge of semiconductor physics and semiconductor devices. Chapters 3～6 talks about the manufacturing technologies and processes. In addition, the integration processes for CMOS and MEMS are highlighted. Chapter 7 is to answer ”what are the ’MtM’ and ’MtM technologies’?” and to derive some indications on ”how to develop a roadmap for the ’MtM’?”. Chapters 8~9 is on professional